PIC Packaging use cases
Photonic Integrated Chips are not just a promise, it’s the next step in scalable, energy-efficient computing, artificial intelligence, and ultra-fast data communication. PhotonFirst is at the forefront of packaging pics capable of dealing with harsh environments
Lens R&D and PhotonFirst join forces to bring space grade photonic innovation from concept to scalable production, starting with the MAUS CubeSat sun sensor and its custom PIC package. This…
Our integrated photonics-based fiber optic sensing systems are now being deployed by ArianeGroup on Themis, the reusable first-stage demonstrator for Europe’s next-generation launcher.
FBG Interrogators designed for Aerospace and Defense Fiber HUMS. PhotonFirst's AGTR-NG4 and AGTR-NEO interrogators represent the forefront of Fiber Bragg Grating (FBG) technology, engineered to deliver unparalleled performance in the…
Solinide needed a partner with the experience and infrastructure to handle precision photonic packaging: fiber coupling, laser alignment, and thermal management. All at micron-level accuracy.