Why PIC packaging matters for your application
PIC Packaging for Mission-Critical Systems
From prototype to deployment in aerospace, infrastructure, offshore and quantum systems – We package PICs for the world’s most demanding environments and develop the systems required to operate them.
Photonic integrated circuits (PICs) enable smaller, faster and more efficient systems across many industries, but only if it is packaged the right way. We design and manufacture packages that keep working under vibration, temperature swings and other harsh conditions found in aerospace, rail, maritime and energy applications.
From the first prototype and proof-of-concept to a ruggedized module that flies on aircrafts, operate within the narrow window of tolerance at data centres and function in industrial harsh environments, we engineer packages that are built for deployment, not just for the lab. Qualified. Deployed. Proven.
Qualified.
Qualified for operation in demanding environments, following aerospace and defense‑grade environmental and EMC standards such as DO‑160G, MIL‑STD‑810 and MIL‑STD‑461.
Deployed.
Deployed as part of interrogator‑based sensing systems in aerospace, energy, wind, maritime and other harsh‑environment applications.
Proven.
Proven in long‑term field use, with package designs derived directly from mission‑critical interrogators like AGTR‑NEO and AGTR‑NG4.
FULL SYSTEM DEVELOPMENT SUPPORT
What you get with Photonfirst
Harsh environments need photonics
Harsh environments do not just need photonics; they need harsh‑environment‑grade PIC packaging. Packages must keep fiber‑to‑chip alignment stable under shock and vibration, maintain optical performance across wide temperature ranges, manage heat inside dense PICs, and protect the system against radiation and moisture satisfying standards like DO‑160G, MIL‑STD‑810, MIL-STD-883-F and MIL‑STD‑461.
This is the space PhotonFirst owns: PIC packaging that is designed so photonic systems do not just function in harsh environments – they thrive there, proven by our proprietary PIC-based interrogators already deployed in aerospace, defence platforms, offshore energy, nuclear plants, quantum computing, data centres and critical infrastructure.
Recent use cases
Today’s prototype can evolve into tomorrow’s industrial module
Our PIC Packaging Portfolio
We do not only package PICs; we are able to design complete packaging journeys that already comply with aerospace and defense‑grade requirements, using the same principles that power our own DO‑160G and MIL‑STD‑compliant interrogators, the NEO and NG4. We use DFM methodologies to always design with an eye on seamlessly scaling from prototypes to < €1k industrial units without “starting over” at each phase.
GP01/02/03
GB01
SIP01
BP01
SIP01
CU01 ..x
From first PIC prototype to integration into mission-critical systems
Our PIC packaging services
Development & prototyping
Fiber(array)-coupled, compact solutions capable of up to 10 GHz modulation for laboratory testing and rapid protoyping. Get your PIC out of the lab fast – with package designs that are ready for scaling.
Typical packages: GP01/02/03, GB01
Ruggedized harsh‑ environment modules
Packages built to survive shock, vibration, EMI and temperature extremes – using the same design principles as our aerospace‑qualified interrogators.
Typical packages: XE01
Miniaturized & integrated modules
PIC, Fibers, Fiber Arrays and PCBAs combined into ultra-compact, rugged, lightweight modules that actually fit inside nacelles, drones, pods, housings and tight system envelopes.
Typical packages: SIP01, BP01
Custom PIC Package
When your application doesn’t fit the catalogue: co‑developed packages and modules, tailored to your (harsh) application environment. Specially tuned to meet your unique optical, thermal, or mechanical requirements.
Typical packages: CU01..x
From PIC to system
PhotonFirst has track record in deploying PICs in humble to challenging environments. We can help you shape your journey from a bare PIC die all the way to tested and deployed system in the field.
Typical systems: AGTR-NEO, AGTR-NG4
From design and (rapid) prototyping to small-series production and system integration
Our PIC packaging capabilities
System integration
PIC Package Design
PIC Testing
Die-bonding
Wire-bonding
Fiber Alignment
Fiber welding
Fiber Array Alignment
Qualification testing
More than a packaging line – a mission‑critical systems partner
What sets PhotonFirst apart
Proven track record in harsh environments, not just the lab
We don’t stop at “optically aligned and sealed”. Numerous unique PIC packages were designed for aerospace, rail, offshore and wind – with harsh environmental requirements (shock, vibration, EMI, temperature, humidity) built in from day one.
Interrogators as proof of system integration capabilities
Most packagers show fixtures; we show flight‑ready interrogators. The same team that packages your PIC also designs and qualifies our own PIC‑based interrogators for aerospace and defense, proving we understand the full system – optics, mechanics, electronics and software.
From prototypes to modules ready for <€1k/unit volumes
We use Design For Manufacturing (DFM) methodologies with a continuous focus towards scaling of your product volumes. The path from your first proof of concept package and low volume production to high volume OEM integration uses the same design principles, process controls and cleanroom line – with no need for new suppliers or redesign.
Co‑development instead of black‑box manufacturing
We don’t just “take a drawing and build a box”, we take care of a complete (custom) package development. We work with your engineers on PIC design rules, thermal and mechanical constraints, and qualification plans – translating your system requirements into PIC, package and test specifications:
- Option A: Your package is developed to your spec with our industrialization know-how, ensuring it fits the exact application
- Option B: Choose from a wide range of standard packages for a quick start
Technical resources to get you started
